“リボール・リワーク” (Reball Rework) is a technological procedure common in electronics production and maintenance.
This procedure includes Ball Grid Array (BGA) components, a surface-mount packaging for integrated circuits.
Reballing mostly restores electrical connections to BGA components.
Solder balls connecting the BGA package to the printed circuit board (PCB) might break due to heat stress or time.
Reballing restores the connection by replacing old solder balls with new ones.
There are some advantages to reballing, such as the fact that, for high-value electronics, reballing may be cheaper than replacing a board or component. Repairing components, rather than discarding them, reduces electronic waste.
Despite some significant challenges, such as the need for specialized equipment and trained employees, as well as the risk of failure, Reballing remains a popular method for repairing video gaming consoles, cellphones, and computers.
Reball Rework is essential for BGA-packaged component lifetime and dependability in electronic device maintenance and repair. Its numerous applications emphasize its relevance in consumer and high-reliability electronics. Despite its limitations, the technique is vital to current electronics maintenance and sustainability.
